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Qualcomm at Mobile World Congress Shanghai 2017 in China introduced a new midrange SoC Snapdragon 450 Mobile Platform, which it had in recent days as a product capable of raising the bar of performance and lower battery consumption for mid-range smartphones and tablets.
Qualcomm Snapdragon 450 is the first SoC in its category to use 14nm FinFET process and is designed to deliver significant improvements in battery life, graphics and compute performance, imaging and LTE connectivity over its predecessor called Qualcomm Snapdragon 435.
Going into more detail, Qualcomm has focused on four key points to make the expected breakthrough in the mid-range smartphone segment.
Improved CPU and GPU: Higher performing octa-core ARM Cortex A53 CPU results in 25 percent increase in compute performance compared to its predecessor. Additionally, the integrated Qualcomm® Adreno™ 506 GPU delivers a 25 percent increase in graphics performance over the Snapdragon 435.
Battery life: Power management improvements result in up to four additional hours of usage time compared to the Snapdragon 435, as well as up to a 30 percent reduction in power when gaming, helping consumers stay connected and productive for much longer. The Snapdragon 450 also comes with Qualcomm® Quick Charge™ 3.0 support, which can charge a typical smartphone from zero to 80 percent in about 35 minutes.
Camera and Multimedia: The Qualcomm Snapdragon 450 is the first in the 400-tier to support real-time Bokeh (Live Bokeh) effects. It is also designed to improve on previous generations by including support for enhanced dual camera at 13+13MP, or single camera support up to 21MP; hybrid autofocus; and 1080p video capture and playback at up to 60fps, enabling slow motion capture. The Snapdragon 450 also includes support for 1920×1200 full HD displays, as well as the Qualcomm® Hexagon™ DSP, which enables multimedia, camera and sensor processing at greater performance and lower power than the previous generation.
Connectivity and USB: Users will enjoy fast LTE connectivity with the Snapdragon X9 LTE modem, which utilizes 2x20MHz carrier aggregation in both downlink and uplink for peak speeds of 300 Mbps and 150 Mbps respectively, support for a large number of mobile networks with Snapdragon All Mode, and 802.11ac with MU-MIMO support. The Snapdragon 450 also supports USB 3.0 which is first in its tier to support fast USB data transfer.
Qualcomm said: To date, more than 1900 designs have launched or are in the pipeline across the Snapdragon 400 tier mobile platforms. And the production will come on stream during the third quarter of 2017 and is expected to be available in consumer devices by the end of 2017.
